V9000-ABI-Power Module Series

Applied to the burn-in testing of high-power power modules/chips for AI servers.

Comprehensive BIB-integrated testing capabilities, facilitating easier maintenance, socket replacement, and disassembly/assembly.

Precise independent temperature control design based on junction temperature (Tj) control provides excellent temperature precision and uniformity for target DUTs.

Fully automated monitoring, recording, and analysis of all Burn-In test data, enabling clear and immediate data analysis and diagnostics.

World's first stackable ABI testing technology—always imitated, never surpassed!

Full-process ESD control during testing ensures DUT quality.

High-precision visual inspection (3D5S, appearance defect detection, QR code recognition, etc.) ensures testing quality.

Energy-recovering load with up to 90% efficiency, saving energy and being environmentally friendly.

Full-stack in-house R&D (embedded software, FPGA, hardware, motion control, electrical, mechanical, thermal design, etc.) enables a fast and responsive service system.

Incorporates AI large models to enable intelligent IC testing.

In 2021, acquired a renowned Japanese handler company with 40 years of precision engineering heritage, offering exquisite product technology and an ultra-low Jam Rate.

World's first ABI fully automated burn-in testing

Supports ultra-high-power DUTs exceeding 600W

Ultra-high parallel test count, three times that of similar products on the market

Independent temperature control design provides excellent temperature precision and uniformity for target DUTs

Full-channel regenerative electronic load enables full-load pulling

High-precision visual AOI inspection ensures testing quality