Chip Sorting_Semiconductor Testing_Chip Burn-in Testing_Acroview Technology Co., Ltd.

High-bandwidth memory (HBM) has become a critical memory technology for the next generation of artificial intelligence (AI) computing and high-performance computing (HPC) systems. As AI workloads continue to expand, the demand for higher memory bandwidth, improved power efficiency, and long-term sys

The pervasive penetration of artificial intelligence technology is driving the global semiconductor industry into an in-depth iteration cycle. As the core foundation of the intelligent industry, chips’ performance iteration, quality control and mass production verification capabilities have become

1. IntroductionIn advanced AI compute systems, power delivery is increasingly a primary design constraint alongside compute density and memory bandwidth. As GPU architectures scale toward higher parallelism and increased workload intensity, device-level current demand is reaching kiloampere-class op