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Efficient system-level testing technology

Accelerate the take-off of automotive semiconductors and AIGC

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Core technology

Automated aging test solution, improving system efficiency 3 times!

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High parallel testing number, up to 1024DUTs can be tested at the same time

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High-precision vision positioning technology, precise chip pick & place P&P components

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Perfect 3D AOI system, ensuring product quality and traceability

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News

800V HVDC and the Power Scaling Limits of AI Infrastructure

2026-05-21

In today's era of surging AI computing power, a brutal physical reality confronts all tech giants: the limit of computing power is energy.As the parameter count of large language models grows exponentially, the power consumption of AI servers is breaking through the limits of infrastructure capa

"AI Dreams, A 'Core' Future" – The 2025 ACROVIEW Annual Gala Concludes Successfully

2026-02-02

Time flies, and new glories unfold. On January 23, 2026, ACROVIEW Group's annual meeting themed AI Dreams, "Chip" Future grandly kicked off on the 5th floor of Crowne Plaza Shenzhen Nanshan by Metro. More than a grand gathering to review the group's annual achievements and unite it

Teradyne and Acroview Announce Strategic Partnership to Transform China's Memory Testing Ecosys

2025-06-24

Shenzhen, China –June 17, 2025– In a landmark move for semiconductor testing, Teradyne (NASDAQ: TER) and Acroview Technology Co., Ltd. (ACROVIEW) today formalized a strategic partnership through a signing ceremony at Acroview's Shenzhen headquarters. The event brought together industry leaders including Teradyne's Asia-Pacific VP Richard Hsieh and Acroview CEO Huang Binhua, alongside key clients and semiconductor association representatives.