AcroviewA8100T Tri-Temperature Test Handler

Acroview A8100T three-temperature test handler provides fully automatic test and sorting solutions for engineering validation and small-batch mass production for memory devices such as DDR, LPDDR, NAND, UFS, and SSD. It offers strong support for customers to achieve fast time-to-market and time-to-profit.


Compatible Equipment:

Various engineering ATE memory testers

AcroviewA8100T Tri-Temperature Test Handler

Product Advantages

High-Precision Servo Drive

  • Transmission mechanism: High-precision timing belt + linear guide rail

  • High-precision servo drive system

  • Repeat placement accuracy up to ±0.02mm

High Flexibility, Simple Changeover

  • High-precision vision alignment for high positioning accuracy

  • Modular design for faster changeover

  • Supports Auto Teach

High-Precision Pressure Test System

  • Supports 4 to 16 DUTs (depending on EV tester configuration)

  • High-precision docking system

  • Chip package: 2x2 to 30x30 mm

  • Temperature control supports -40 to 125°C

  • Modular design for fast changeover (pressure test head change ~100 minutes, nozzle change<1 minute="">

Vision System

  • Dual-camera vision alignment enhances system adaptability

  • Capable of inspecting chip position and bottom QR codes, with vision accuracy ±0.01mm

  • Optional top camera for reading top-side QR codes on chips

AcroviewA8100T Tri-Temperature Test Handler

AcroviewA8100T Tri-Temperature Test Handler

AcroviewA8100T Tri-Temperature Test Handler

Product Specifications

Equipment PerformanceRepeat Placement Accuracy±0.02 mm
Pick & Place MechanismVacuum nozzles x 2
UPH
Up to 1029 UPH
Control SystemX-Y-Z Axis DriveHigh-performance servo drive system
Transmission StructureHigh-precision timing belt + linear guide rail
ResolutionX/Y/Z axes: 0.001 mm
Z-Axis AssemblyRotationDual nozzles 360° synchronous rotation
Stack Detection±0.05 mm
Test UnitNumber of SitesSupports 1 to 16 sites (32-site and 48-site optional)
Chip Specification2x2 to 30x30 mm (chips under 3x3 mm require special fixture)
Test MethodPogo pin socket press test or open-top socket
TesterSupports most testers via cable or docking connection
CommunicationGPIB, TTL
Input MethodTrayMax 20 trays
Tray specification: JEDEC
Output MethodTrayAuto BIN x 1, Fix BIN x 3
Tray specification: JEDEC
BulkFix BIN x 8
Tube specification: Customized
Vision SystemTop lighting cameraCapable of inspecting chip position and bottom QR codes, vision accuracy ±0.01 mm
Temperature Control SystemHigh Temperature50 to 125°C ±3°C
Low Temperature-40 to 0°C ±3°C (optional)
KIT TypesTest Pressure HeadChange time: Within 100 minutes
NozzleChange time: Within 1 minute
Socket Board\
SHT FixtureChange time: Within 30 minutes
BIN ClassificationAuto BIN1 category
Fix BINFix Tray: 3 categories, Tube: 8 categories
StabilityJam RateWithin 0.2%
MTBF720 hours
ESD ProtectionIonizing FanIonizing fan installed in work area for static elimination
Anti-static MaterialsAll components in product-related areas use anti-static materials
GroundingGrounding resistance ≤1 ohm (≤10 ohms for moving parts)
Operating SystemOSWindows 11
Display & Input Devices21-inch LCD monitor x 1, keyboard x 1, mouse x 1, control handle
Operating EnvironmentElectrical Specifications200V to 240V single phase / 50-60 Hz / 2 kW (rated power), Air pressure: 0.4 to 0.6 MPa, approx. 40 L/min
WeightApprox. 1200 kg
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