HBM High-Speed Memory Burn-In Test Solution

In the era of rapid AI development, market demand for HBM high-bandwidth memory and computing chips continues to rise. The Acroview V9000-HBM/SoC-T three-temperature burn-in test system precisely meets the core requirements for HBM and SoC burn-in testing: adapting to multi-layer stacking, high-speed I/O, and high-power scenarios, achieving precise temperature control, dynamic stress, high-speed signal integrity, and early failure screening, fully satisfying high-reliability applications in automotive and AI servers. Future evolution will focus on TDBI dynamic burn-in, full process traceability, high-power parallel testing, and automated capacity expansion, with simultaneous compatibility for HBM3E/HBM4/CPU/GPU/FPGA/MCU, continuously improving UPH and yield.

Product Advantages

Ultra-High Parallel Testing Capability

Supports up to 1920 DUTs tested in parallel
High UPH design, mature and stable, ready for mass production

High-Precision Thermal Management and Pressure Control

Real-time monitoring of DUT status, temperature, pressure, and condensation
Independent temperature control, supports -40°C to 150°C, temperature accuracy ±3°C
Independent pressure control ensures stable and reliable contact, pressure accuracy 5%

Innovative Fully Automated Burn-in Testing

Fully automated process for loading/unloading, BIB board transport, testing and sorting, no manual intervention required
Supports automated HTOL/LTOL and BI testing, reducing human error
Key operations traceable, production batch binding, full process traceability
Unified engineering and mass production platform, enabling fast production ramp-up and cost reduction

Highly Reliable Self-Developed Test System

Test resource boards can be configured as needed, PPMU function enhances channel flexibility
Independently developed, supports customized requirements
Supports ALPG function, logic vector depth of 128M

HBM High-Speed Memory Burn-In Test Solution

Product Specifications

Equipment Performance Indicators

Equipment Dimensions (WDH)	4550mm × 3900mm × 2000mm
IC Package Type	BGA
IC Package Dimensions	3mm × 3mm ~ 30mm × 30mm
Loading/Unloading Method	Tray In & Tray Out
Test Sites	1920
Temperature Range	-40~150°C
Temperature Accuracy	±3°C
Communication Interface	TCP/IP, or adaptable to other interfaces
Repeat Positioning Accuracy	±0.02mm
Jam Rate	<1/5000
Up time	>98.5%
MTBA (Mean Time Between Assists)	Non-stop failure: interval ≥ 1 hr; Stop failure: interval ≥ 2 hrs. Non-stop failure: equipment alarm, does not affect equipment use; Stop failure: mechanical damage, abnormal standard parts, serious fault requiring shutdown for troubleshooting;
MTBF (Mean Time Between Failures)	≥24 hrs
Noise	≤75 decibels Note: Measured at 4 points 1 meter from the machine at a height of 1.5 meters; ambient noise less than 70 decibels.

Digital Board (PE) Parameters

Io Channels	256/BIB
Test Frequency	25MHz
Timing Resolution	1.25ns
Rise Time / Fall Time	<4ns @ 2V swing
Timing Accuracy	+/-700ps
IO Drive Voltage	-1.5V ~ 6V
IO Drive Current	+/-20mA -> 120mA
Logic Vector Depth	128M
Failure HRAM	128M
ALPG Function	Supported
Pin Share Function	Supported

Power Supply Board (DPS) Parameters

DP Voltage Range	Quantity	Current Range	Voltage Force	Current Measure
0.5V-1V (Vout1)
0~200A	Resolution: 10bit - 1.5625mV Accuracy: +/-1%	Resolution: 62.5mA Accuracy: +/-4%
0.5V-2V (Vout2)	1	0~50A	Resolution: 10bit - 1.5625mV Accuracy: +/-1%	Resolution: 62.5mA Accuracy: +/-4%
0.5V-3V (Vout3)	8	0~10A	Resolution: 16bit - 1.25mV Accuracy: +/-1%	Resolution: 16bit - 0.5mA Accuracy: +/-3%
0.5V-5V (Vout4)	6	0~2A	Resolution: 16bit - 1.25mV Accuracy: +/-1%	Resolution: 16bit - 0.25mA Accuracy: +/-3%

PMU (DC) Parameters

Parameter

Range

Resolution

Accuracy

FV	-1.5V ~ 6V	16bit	±(0.2% + 5 mV + 2 mV/10 mA)
FI	±2μA	16bit	±(0.5%FI + 0.5% IRange + 20 nA/V)
	±20μA		±(0.2%FI + 0.5% IRange + 100 nA/V)
	±200μA		±(0.2%FI + 0.3% IRange + 500 nA/V)
	±2mA		±(0.2%FI + 0.3% IRange + 1 μA/V)
	±50mA		±(0.2%FI + 0.3% IRange + 10 μA/V)
MV	-1.5V ~ 6V	18bit	±(0.5% + 2 mV + 1 mV/10mA)
MI	±2μA	18bit	±(0.5%FI + 0.5% IRange + 20 nA/V)
	±20μA		±(0.2%FI + 0.5% IRange + 100 nA/V)
	±200μA		±(0.2%FI + 0.3% IRange + 500 nA/V)
	±2mA		±(0.2%FI + 0.3% IRange + 1 μA/V)
	±50mA		±(0.2%FI + 0.3% IRange + 10 μA/V)

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Acroview technology

HBM High-Speed Memory Burn-In Test Solution

Product Advantages

Product Specifications