Power Module Burn-In Test Solution

Acroview has been deeply involved in the AI power module burn-in testing field for many years. With its key technical capabilities such as high parallel test count, full-load high-current loading, and independent temperature control, the V9000-ABI power burn-in test system has become a must-have product for customers in this field. It is the world's first large-scale parallel stackable burn-in test system, an all-in-one machine for fully automatic burn-in testing and sorting of power modules for AI servers and automotive power chips, supporting burn-in testing and sorting from room temperature to high temperatures.

Application Fields

Power Module Burn-In Test Solution

Product Advantages

Meets stringent conditions for power module burn-in testing

  • Innovative heat dissipation design: Air cooling load rate 50%~60%, liquid cooling 100% 

  • Burn-in conditions simulate real-world applications, especially suitable for vertical power supply architectures

  • Independent temperature control per DUT, accuracy ±2℃

  • Fully traceable data with software-customizable power-up sequencing

Truly fully automated testing

  • Ultra-high UPH, standard 512 DUTs parallel test, expandable to 1000+

  • Fully automatic loading and unloading, high-precision DUT test pressure adjustment

  • Scannable multiple QR codes on product to ensure traceability

  • Short changeover time, supports vision alignment

  • Optional AOI and laser marking functions

Reduces operating costs and increases productivity

  • Energy feedback load significantly reduces operating electricity costs

  • Innovative socket and BIB heat dissipation structure design extends BIB board life

  • Modular BIB design reduces changeover costs

Power Module Burn-In Test Solution

Burn-In Test Box Design

  • The Burn-In test box, as the system's core unit, adopts a multi-box stackable architecture for the test library.

  • The test box integrates a CCU main control unit, digital boards, and analog boards, supporting flexible configuration of up to 8 boards.

  • The digital board handles DUT digital interfaces, EN/PG signal stimulation, and global status monitoring, enabling I2C/SPI high-speed bus communication and accurately collecting DUT core temperature and register data.

  • The analog board monitors key analog parameters such as VIN/VOUT/IIN/IOUT in real time, while simultaneously performing intelligent health checks on Pogo pin contacts.

  • The 16-channel source and load modules provide the DUT with multiple input power rails, high-efficiency energy-feedback loads, full-parameter voltage and current monitoring, and are equipped with multiple floating control power supplies.

  • The system is compatible with both water-cooling and air-cooling solutions. Relying on the ASC system, it achieves independent and precise temperature control for each DUT and intelligent regulation of the burn-in environment.

BIB Board Design

  • Maximized test site count based on customer chip: BIB board accommodates 16 sockets;

  • Burn-in board uses mother-daughter board design to increase compatibility and reduce maintenance costs;

  • Modular docking interface supports both high current and high-speed interfaces;

  • Meets high-current programmable power requirements, supporting up to 1500W per DUT;

  • Zero-current disconnection design avoids current surges when test board is disconnected;

  • Real-time monitoring function for high-current pin contact resistance;

  • Equipped with automatic lid opening/closing mechanism.

Power Module Burn-In Test Solution

Power Module Burn-In Test Solution

Power Module Burn-In Test Solution

Product Specifications

Handler SpecsDevice Size RangeFrom 3*3mm to 100*100mm
Operation ModesNormal mode, Practice mode, Empty run mode
Control SystemIndustrial PC
Operating SystemWindows
MTBA>4 Hrs
UPHUPH ≥ 1000
Test Sites1 site
Test Channels1-4 CH
Mechanical StructureEnclosed type
Operating Air Pressure0.4-0.6 MPa
Operating Voltage220V AC / 50Hz
Equipment WeightApprox. 600 kg
Equipment Dimensions1200*1300*1850 mm
Operating EnvironmentTemperature: 15-35℃, Humidity: 30-70%
Storage EnvironmentTemperature: -20-60℃, Humidity: 20-80%
Cooling MethodForced air cooling
Safety ProtectionSafety door, emergency stop button, overload protection
TOP