Acroview has been deeply involved in the AI power module burn-in testing field for many years. With its key technical capabilities such as high parallel test count, full-load high-current loading, and independent temperature control, the V9000-ABI power burn-in test system has become a must-have product for customers in this field. It is the world's first large-scale parallel stackable burn-in test system, an all-in-one machine for fully automatic burn-in testing and sorting of power modules for AI servers and automotive power chips, supporting burn-in testing and sorting from room temperature to high temperatures.

Meets stringent conditions for power module burn-in testing
Innovative heat dissipation design: Air cooling load rate 50%~60%, liquid cooling 100%
Burn-in conditions simulate real-world applications, especially suitable for vertical power supply architectures
Independent temperature control per DUT, accuracy ±2℃
Fully traceable data with software-customizable power-up sequencing
Truly fully automated testing
Ultra-high UPH, standard 512 DUTs parallel test, expandable to 1000+
Fully automatic loading and unloading, high-precision DUT test pressure adjustment
Scannable multiple QR codes on product to ensure traceability
Short changeover time, supports vision alignment
Optional AOI and laser marking functions
Reduces operating costs and increases productivity
Energy feedback load significantly reduces operating electricity costs
Innovative socket and BIB heat dissipation structure design extends BIB board life
Modular BIB design reduces changeover costs

The Burn-In test box, as the system's core unit, adopts a multi-box stackable architecture for the test library.
The test box integrates a CCU main control unit, digital boards, and analog boards, supporting flexible configuration of up to 8 boards.
The digital board handles DUT digital interfaces, EN/PG signal stimulation, and global status monitoring, enabling I2C/SPI high-speed bus communication and accurately collecting DUT core temperature and register data.
The analog board monitors key analog parameters such as VIN/VOUT/IIN/IOUT in real time, while simultaneously performing intelligent health checks on Pogo pin contacts.
The 16-channel source and load modules provide the DUT with multiple input power rails, high-efficiency energy-feedback loads, full-parameter voltage and current monitoring, and are equipped with multiple floating control power supplies.
The system is compatible with both water-cooling and air-cooling solutions. Relying on the ASC system, it achieves independent and precise temperature control for each DUT and intelligent regulation of the burn-in environment.
Maximized test site count based on customer chip: BIB board accommodates 16 sockets;
Burn-in board uses mother-daughter board design to increase compatibility and reduce maintenance costs;
Modular docking interface supports both high current and high-speed interfaces;
Meets high-current programmable power requirements, supporting up to 1500W per DUT;
Zero-current disconnection design avoids current surges when test board is disconnected;
Real-time monitoring function for high-current pin contact resistance;
Equipped with automatic lid opening/closing mechanism.



| Handler Specs | Device Size Range | From 3*3mm to 100*100mm |
| Operation Modes | Normal mode, Practice mode, Empty run mode | |
| Control System | Industrial PC | |
| Operating System | Windows | |
| MTBA | >4 Hrs | |
| UPH | UPH ≥ 1000 | |
| Test Sites | 1 site | |
| Test Channels | 1-4 CH | |
| Mechanical Structure | Enclosed type | |
| Operating Air Pressure | 0.4-0.6 MPa | |
| Operating Voltage | 220V AC / 50Hz | |
| Equipment Weight | Approx. 600 kg | |
| Equipment Dimensions | 1200*1300*1850 mm | |
| Operating Environment | Temperature: 15-35℃, Humidity: 30-70% | |
| Storage Environment | Temperature: -20-60℃, Humidity: 20-80% | |
| Cooling Method | Forced air cooling | |
| Safety Protection | Safety door, emergency stop button, overload protection |