Acroview technology
In the era of rapid AI development, market demand for HBM high-bandwidth memory and computing chips continues to rise. The Acroview V9000-HBM/SoC-T three-temperature burn-in test system precisely meets the core requirements for HBM and SoC burn-in testing: adapting to multi-layer stacking, high-speed I/O, and high-power scenarios, achieving precise temperature control, dynamic stress, high-speed signal integrity, and early failure screening, fully satisfying high-reliability applications in automotive and AI servers. Future evolution will focus on TDBI dynamic burn-in, full process traceability, high-power parallel testing, and automated capacity expansion, with simultaneous compatibility for HBM3E/HBM4/CPU/GPU/FPGA/MCU, continuously improving UPH and yield.
Product Advantages
Ultra-High Parallel Test Capacity
Supports up to 1920 DUTs tested simultaneously
High UPH design, mature and stable, ready for mass production
High-Precision Thermal Management and Pressure Control
Real-time monitoring of DUT status, temperature, pressure and condensation
Independent temperature control, -40℃ to 150℃ supported, temperature accuracy ±3℃
Independent pressure control ensures stable and reliable contact, with pressure accuracy of 5%
Innovative Fully Automatic Burn-In Testing
Full-process automation of loading/unloading, BIB burn-in board transfer and test sorting, no manual intervention required
Supports automated HTOL/LTOL and BI testing, reducing human errors
Traceable key operations, production batch binding, full-process traceability
Unified platform for engineering and mass production, enabling rapid mass production ramp-up and cost reduction
High-Reliability Self-Developed Test System
Test resource boards configurable on demand, PPMU function enhances channel flexibility
Self-developed, supporting customized requirements
ALPG function supported, with logic vector depth of 128M
Digital Test Board (PE)
High density, 128 channels per board
VI capability, per pin PPMU
Each board is equipped with an independent vector generator
Sufficient vector depth, 64M per pin
Flexible timing format with 4 DriveEdges + 2 ReceiveEdges, supporting various custom waveforms
ECR/DBM/LEC supported, DC test insertion available during pattern operation
Memory test capability with ALPG support
Power Supply Board (DPS)
High density, 32 channels per board
High power, each channel delivers 3V/10A or 5V/5A
Voltage and current measurement: current ±5mA, voltage ±2mV
Gang capability, up to 2 channels in gang mode
Power-up and power-down sequence control
Comprehensive protection: configurable OCP/OVP thresholds, V/I Clamp support, and UVP undervoltage protection
Measurement Board (ADC)
High density, 128 channels
High resolution, 16-bit
Wide input range, ±10V/±5V selectable
Low noise: SNR ≥90dB, THD ≤-100dB, sampling accuracy ±0.1% FS
Product Specifications
Equipment Performance Indicators
Overall Dimensions (W×D×H) | 4550mm × 3900mm × 2000mm |
IC Package Type | BGA |
IC Package Size | 3mm × 3mm ~ 30mm × 30mm |
Loading/Unloading Method | Tray In & Tray Out |
Test Stations | 1920 |
Temperature Range | -40℃ to 150℃ |
Temperature Accuracy | ±3℃ |
Communication Interface | TCP/IP, or compatible with other interfaces |
Repeat Positioning Accuracy | ±0.02mm |
Jam Rate | < 1/5000 |
Up time | > 98.5% |
MTBA (Mean Time Between Assists) | Non-stop faults: interval ≥ 1 hour; stop faults: interval ≥ 2 hours. Non-stop faults: equipment alarms that do not affect operation; Stop faults: mechanical component damage, standard part abnormalities, or severe faults requiring shutdown for troubleshooting; |
MTBF (Mean Time Between Failures) | ≥ 24 hours |
Noise | ≤ 75 dB Note: Measured at 4 points 1 meter away from the machine at a height of 1.5 meters; ambient noise is less than 70 dB. |
- 7F, Hanking Center (SOMA) 9968 Shennan Avenue, Nanshan Dist, Shenzhen, 518052, P.R.C
- sales@acroview.com