Acroview has been deeply involved in the AI power module burn-in testing field for many years. With its key technical capabilities such as high parallel test count, full-load high-current loading, and independent temperature control, the V9000-ABI power burn-in test system has become a must-have pro

In the era of rapid AI development, market demand for HBM high-bandwidth memory and computing chips continues to rise. The Acroview V9000-HBM/SoC-T three-temperature burn-in test system precisely meets the core requirements for HBM and SoC burn-in testing: adapting to multi-layer stacking, high-spee

The Acroview V9000-SLT test solution delivers efficient, high-quality SLT testing for LPDDR 4/5 products. The solution flexibly integrates with peripherals and operates fully automatically to reduce human error. Featuring an innovative parallel stackable design supporting 1680 DUTs tested simultaneo

MEMS sensors integrate multiple physical fields such as mechanical, electrical, thermal, magnetic, and fluid dynamics. Testing requires the simultaneous application and precise control of multi-dimensional physical stimuli including acceleration, angular velocity, pressure, temperature, and magnetic

Acroview A8100T three-temperature test handler provides fully automatic test and sorting solutions for engineering validation and small-batch mass production for memory devices such as DDR, LPDDR, NAND, UFS, and SSD. It offers strong support for customers to achieve fast time-to-market and time-to-p

The Acroview V9000-SLT test solution delivers efficient, high-quality SLT testing for LPDDR 4/5 products. The solution flexibly integrates with peripherals and operates fully automatically to reduce human error. Featuring an innovative parallel stackable design supporting 1680 DUTs tested simultaneo

Acroview's NAND storage particle SLT test solution is specifically designed for 3D NAND storage particles, providing a turn-key full-stack testing service that effectively eliminates early failures. The temperature testing range and accuracy have been comprehensively upgraded to meet demanding e

Product AdvantagesParallel test count can be customized based on requirementsFlexible configuration, can be flexibly expandedSupports all SSD module form factorsPower supply voltage regulation technology for more accurate and stable power deliverySupports PCIe Gen 5.0, backward compatible with PCIe

In the era of rapid AI development, market demand for HBM high-bandwidth memory and computing chips continues to rise. The Acroview V9000-HBM/SoC-T three-temperature burn-in test system precisely meets the core requirements for HBM and SoC burn-in testing: adapting to multi-layer stacking, high-spee

Teradyne's memory test solutions are designed for high-speed, precise data signals, including:Magnum EPICTeradyne Magnum EPIC is a high-performance test solution for the latest generation of DRAM devices. These devices are key drivers for technologies such as 5G, AI, cloud computing, autonomous

DSA (Device Specific Adapter) is a critical interface board between Teradyne's ATE and the DUT/handler. Acroview, together with LUKEN, a world-leading provider of semiconductor test interface solutions, has developed high-speed DSA interface boards for memory devices such as DDR, LPDDR, GDDR, NA