High-bandwidth memory (HBM) has become a critical memory technology for the next generation of artificial intelligence (AI) computing and high-performance computing (HPC) systems. As AI workloads continue to expand, the demand for higher memory bandwidth, improved power efficiency, and long-term sys

The pervasive penetration of artificial intelligence technology is driving the global semiconductor industry into an in-depth iteration cycle. As the core foundation of the intelligent industry, chips’ performance iteration, quality control and mass production verification capabilities have become

1. IntroductionIn advanced AI compute systems, power delivery is increasingly a primary design constraint alongside compute density and memory bandwidth. As GPU architectures scale toward higher parallelism and increased workload intensity, device-level current demand is reaching kiloampere-class op

IntroductionAs AI computing platforms continue to increase in power density, ensuring reliable power delivery has become a fundamental engineering challenge. High-performance AI servers operate under significantly higher electrical and thermal stress than conventional computing platforms, placing in

In today's era of surging AI computing power, a brutal physical reality confronts all tech giants: the limit of computing power is energy.As the parameter count of large language models grows exponentially, the power consumption of AI servers is breaking through the limits of infrastructure capa

Time flies, and new glories unfold. On January 23, 2026, ACROVIEW Group's annual meeting themed AI Dreams, "Chip" Future grandly kicked off on the 5th floor of Crowne Plaza Shenzhen Nanshan by Metro. More than a grand gathering to review the group's annual achievements and unite it

As the wave of semiconductors sweeps through global manufacturing, each technological iteration reshapes the industrial landscape. On December 18, 2025, the highly anticipated 21st South China SMT Academic and Applied Technology Annual Conference will commence at the Shenzhen Baoan Denhill Internati

Shenzhen, China –June 17, 2025– In a landmark move for semiconductor testing, Teradyne (NASDAQ: TER) and Acroview Technology Co., Ltd. (ACROVIEW) today formalized a strategic partnership through a signing ceremony at Acroview's Shenzhen headquarters. The event brought together industry leaders including Teradyne's Asia-Pacific VP Richard Hsieh and Acroview CEO Huang Binhua, alongside key clients and semiconductor association representatives.

From April 22nd to 24th, the 33rd China International Electronics Manufacturing Equipment and Microelectronics Industry Exhibition (NEPCON China 2025) successfully concluded at the Shanghai World Expo Exhibition & Convention Center. As a premier annual event for the global electronics manufactur

With the rapid development of technology, the electronics manufacturing industry is undergoing unprecedented changes. Following the two exhibitions in Shanghai in March, Acroviewwill once again host a major exhibition in Shanghai in April. From April 22nd to 24th, 2025, the 33rd China Internat