The pervasive penetration of artificial intelligence technology is driving the global semiconductor industry into an in-depth iteration cycle. As the core foundation of the intelligent industry, chips’ performance iteration, quality control and mass production verification capabilities have become core factors underpinning and restricting the high-quality development of the AI industry. The 2026 World Artificial Intelligence Conference & Global Summit on AI Governance (WAIC 2026), themed
Intelligent Partners, Co-Create the Future, will grandly take place from July 17 to 20 in Shanghai, covering the Expo Center, Expo Exhibition Hall, Zhangjiang Science Hall and West Bund International Convention & Exhibition Center.
As the world’s top comprehensive industrial summit for AI, this year’s conference boasts an exhibition area exceeding 100,000 square meters, gathering over 1,100 leading global enterprises to showcase more than 3,000 cutting-edge innovative achievements. More than 140 professional themed forums will be held concurrently, building a core platform for global technology exchange, industrial collaboration and ecosystem co-construction, and continuously guiding the integrated development trend of artificial intelligence and the real economy.
A specialized, sophisticated, distinctive and innovative enterprise deeply rooted in semiconductor testing and aligned with the underlying transformation logic of the industry, ACROVIEW takes technological innovation as its core driving force. Keeping pace with the explosive growth of the AI industry, it continuously addresses industry pain points through forward-looking strategic layout and breakthrough core technologies. At this conference, ACROVIEW will showcase its full suite of self-developed semiconductor testing solutions at Booth Z1C-801, Zhangjiang Science Hall, Shanghai. It empowers the implementation of intelligent industries with state-of-the-art testing technologies and demonstrates the core competitiveness of domestic semiconductor equipment via independent innovation capabilities.
With years of profound accumulation in the chip programming sector, ACROVIEW has long-term proven expertise. Its stable and reliable fully automatic programming solutions serve numerous leading global enterprises, accumulating solid engineering experience and mature technical systems through rigorous mass production scenarios. Riding the wave of industrial upgrading and domestic substitution, ACROVIEW accurately identifies core industry pain points and proactively lays out the high-end semiconductor testing track, assembling an R&D team consisting of top global industry talents. Leveraging world-leading testing processes, ultra-high precision sorting technology and AI intelligent optimization algorithms, the company has built a core technology matrix with fully independent intellectual property rights, setting a benchmark for the independent and high-end development of China’s integrated circuit industry.
Independent breakthroughs in core technologies constitute the fundamental confidence for ACROVIEW to achieve transformative industrial advancement. Its self-developed products are highly compatible with the rapid growth of the AI and new energy vehicle industries, covering two core high-demand scenarios:
Complete Burn-In reliability aging testing support for core chips including AI large model training SoCs, GPUs, CPUs, autonomous driving SoCs for vehicles and high-end power modules, laying a solid quality foundation for high-end intelligent hardware;
Comprehensive system-level testing for general SoCs, high-capacity memory chips, RF chips and modules, catering to diverse mass production demands across the entire semiconductor industrial chain and helping the chip industry improve quality, cut costs and boost efficiency.
As iterations of AI computing chips and high-end automotive chips accelerate, the industry faces rising requirements for high power, high consistency and high reliability in testing and verification. Precise and reliable testing under extreme working conditions has emerged as a critical industry bottleneck. To tackle this challenge, ACROVIEW’s V9000 series fully automatic aging testers deliver disruptive technological innovations with all-round upgrades in process architecture and hardware performance.
Process Architecture: The industry’s first fully online automated Burn-In testing solution realizes standardized, digitalized and closed-loop management of the entire testing workflow. It eliminates potential risks such as operational errors, missing data and ESD electrostatic damage caused by manual intervention, ensures full traceability of test data, and greatly improves testing consistency and reliability.
Hardware Performance: Equipped with ACROVIEW’s exclusive self-developed TempJIT™ high-power aging test temperature control technology, the equipment supports a maximum single DUT power load of 1,500 W, over 1.5 times the performance of traditional equipment. It successfully breaks through testing bottlenecks for high-end computing and high-power AI chips, filling domestic technical gaps in relevant fields.
Backed by its leading core technology system, ACROVIEW has launched the world’s first stacked high-capacity testing system. It delivers highly competitive all-scenario SLT and Burn-In testing solutions for mainstream memory and computing chips including DDR, LPDDR, HBM, UFS, eMMC, NAND and SSD. The products lead the industry in ultra-high parallel testing capacity, ultra-high precision independent temperature control and accurate test pressure regulation, fully serving clients across the whole industrial chain including Fabless companies, IDMs, OSATs, wafer fabs and terminal equipment manufacturers.
Decades of technological iteration and experience accumulation have enabled ACROVIEW to form a full-process equipment solution portfolio covering PSV, CP, FT, ABI, SLT testing and chip programming. By deeply integrating self-developed technological strengths, system-level engineering experience and global R&D layout, the company provides one-stop customized semiconductor testing and mass production solutions for industrial chain partners, helping clients consolidate product quality, optimize production costs and enhance core market competitiveness.
Intelligent Connectivity for the Future, Chips Usher in a New Journey.
From July 17 to 20, visit Booth Z1C-801 at Zhangjiang Science Hall, Shanghai. ACROVIEW sincerely invites global industrial peers, industry experts and partners to come for exchanges. Let us jointly explore innovative paths for the semiconductor industry in the AI era, discuss technological innovation trends of high-end chip testing, and boost the high-quality advancement of the semiconductor industry through technological symbiosis and ecosystem co-construction.
