Teradyne's memory test solutions are designed for high-speed, precise data signals, including:

Teradyne Magnum EPIC is a high-performance test solution for the latest generation of DRAM devices. These devices are key drivers for technologies such as 5G, AI, cloud computing, autonomous driving, AR/VR, and high-definition graphics applications.

Teradyne has launched the Magnum 7H platform for HBM testing, achieving industry-leading speed and parallel test efficiency. With advanced memory and logic test capabilities, this platform supports multiple key test stages in HBM manufacturing: from base die wafer testing to pre-singulation HBM testing and post-singulation HBM testing, including core memory testing and speed validation.

Teradyne's Magnum 7 platform features an intelligent design to meet the demanding requirements of next-generation NAND flash memory chip testing. High-speed flash memory chips provide critical support for next-generation UFS and PCIe applications. AI innovation is powered by massive amounts of data stored in high-performance data center SSDs as well as new-generation AI PCs, laptops, and mobile devices. The maximum configuration of the Magnum 7 supports up to 18,432 I/O channels, each operating at up to 5.28 Gbps.

Teradyne Magnum VU is a flexible and powerful test platform suitable for all NAND and MCP products, including advanced UFS 4.1, MCP and PCIe Gen5 mobile and automotive devices, as well as ONFI/Toggle NAND and previous-generation MCPs such as UFS 3.1, PCIe Gen4, e.MMC, and eMCP.

Teradyne's Magnum V system provides high throughput and high parallel test efficiency for ultra-high-performance flash memory and DRAM memory. The maximum configuration of the Magnum V offers up to 20,480 digital channels, each with a data rate of up to 1700 Mbps.