
Applied to the burn-in testing requirements of storage devices such as eMMC, UFS, and Nand/Nor Flash.
Fully automated testing process ensures traceability.
Full-process ESD control during testing ensures DUT quality.
Single sorter module achieves an ultra-high UPH of up to 6000.
Ultra-precise DUT test pressure control: accuracy of 0.1N, carefully protecting the chip and socket.
Integrated high-precision measurements: OS/Leakage, IDD6, and other DC tests.
Supports vector depth of 128M per pin.
High-precision visual inspection (3D5S, appearance defect detection, QR code recognition, etc.) ensures testing quality.
Full-stack in-house R&D (embedded software, FPGA, hardware, motion control, electrical, mechanical, thermal design, etc.) enables a fast and responsive service system.
Incorporates AI large models to enable intelligent IC testing.
In 2021, acquired a renowned Japanese handler company with 40 years of precision engineering heritage, offering exquisite product technology and an ultra-low Jam Rate.





| Supported Device Types | QFN, QFP, LGA, PLCC, PGA, CSP, TSOP, etc. |
| Device Size Range | From 3x3 mm to 100x100 mm |
| Operation Mode | Normal Mode, Practice Mode, Dry-Run Mode |
| Control System | Industrial Computer |
| Operating System | WINDOWS |
| MTBA | > 4 Hours |
| UPH | UPH ≥ 1000 |
| Down Time | < 3% (when running continuously for 3 months) |
| Index Time | < 0.4s (Minimum: 0.38s) |
| Jam Rate | ≤ 1/5000 |
| Temperature Control Range | Room Temperature to 125°C (DUT temperature can reach up to 150°C) |
| Tray Standard | JEDEC Standard |
| Tray Loading/Unloading Mechanism | 1x Automatic Loader / 4x Automatic Unloaders (Expandable) |
| Empty Tray Handling | Gripper Type |
| Software Binning | Bin1 - Bin16 |
| Power Supply Specification | 50/60 Hz, Max. 50A, AC 380V (Three-Phase) |
| Machine Weight | 3500 kg |
| Machine Dimensions (L x W x H) | 3189 x 3400 x 1920 mm |