V9000-ABI-Storage Series

Summary
Applied to the burn-in testing requirements of storage devices such as eMMC, UFS, Nand/Nor Flash.
Feature

Ultra-high parallel test site count; test site RACKs support unlimited cascading; fully automated clustered testing rooms; maximized testing space efficiency.

Independent temperature control design provides excellent temperature precision and uniformity for target DUTs, supporting a three-temperature range (-45~125°C).

The world's first stackable ABI testing technology—always followed, never surpassed!

V9000-ABI-Storage Series
  • Applied to the burn-in testing requirements of storage devices such as eMMC, UFS, and Nand/Nor Flash.

    Fully automated testing process ensures traceability.

    Full-process ESD control during testing ensures DUT quality.

    Single sorter module achieves an ultra-high UPH of up to 6000.

    Ultra-precise DUT test pressure control: accuracy of 0.1N, carefully protecting the chip and socket.

    Integrated high-precision measurements: OS/Leakage, IDD6, and other DC tests.

    Supports vector depth of 128M per pin.

    High-precision visual inspection (3D5S, appearance defect detection, QR code recognition, etc.) ensures testing quality.

    Full-stack in-house R&D (embedded software, FPGA, hardware, motion control, electrical, mechanical, thermal design, etc.) enables a fast and responsive service system.

    Incorporates AI large models to enable intelligent IC testing.

    In 2021, acquired a renowned Japanese handler company with 40 years of precision engineering heritage, offering exquisite product technology and an ultra-low Jam Rate.


    Feature functions
    V9000-ABI-Storage Series - World's first ABI fully automated burn-in testing.
    World's first ABI fully automated burn-in testing.
    V9000-ABI-Storage Series - Independent temperature control design provides excellent temperature precision and uniformity for target DUTs.
    Independent temperature control design provides excellent temperature precision and uniformity for target DUTs.
    V9000-ABI-Storage Series - High-precision visual AOI inspection ensures testing quality.
    High-precision visual AOI inspection ensures testing quality.
    V9000-ABI-Storage Series - Incorporates AI large models to enable intelligent IC testing.
    Incorporates AI large models to enable intelligent IC testing.
    V9000-ABI-Storage Series - Full-process ESD control ensures safe and controllable testing procedures.
    Full-process ESD control ensures safe and controllable testing procedures.
  • Supported Device TypesQFN, QFP, LGA, PLCC, PGA, CSP, TSOP, etc.
    Device Size RangeFrom 3x3 mm to 100x100 mm
    Operation ModeNormal Mode, Practice Mode, Dry-Run Mode
    Control SystemIndustrial Computer
    Operating SystemWINDOWS
    MTBA> 4 Hours
    UPHUPH ≥ 1000
    Down Time< 3% (when running continuously for 3 months)
    Index Time< 0.4s (Minimum: 0.38s)
    Jam Rate≤ 1/5000
    Temperature Control RangeRoom Temperature to 125°C (DUT temperature can reach up to 150°C)
    Tray StandardJEDEC Standard
    Tray Loading/Unloading Mechanism1x Automatic Loader / 4x Automatic Unloaders (Expandable)
    Empty Tray HandlingGripper Type
    Software BinningBin1 - Bin16
    Power Supply Specification50/60 Hz, Max. 50A, AC 380V (Three-Phase)
    Machine Weight3500 kg
    Machine Dimensions (L x W x H)3189 x 3400 x 1920 mm
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