Acroview technology
国家级专精特新小巨人企业
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Applied to the burn-in testing requirements of logic devices including AI server GPUs, CPUs, high-speed interconnect chips, SOCs, FPGAs, and MPUs/MCUs.
Feature functions
Supports ultra-high-power SOC chips exceeding 1000W.
Ultra-high parallel test count, three times that of similar products on the market.
World's first ABI fully automated burn-in testing.
High-precision visual AOI inspection ensures testing quality.
Incorporates AI large models to enable intelligent IC testing. -
Supported Device Types QFN, QFP, LGA, PLCC, PGA, CSP, TSOP, etc. Device Size Range From 3x3 mm to 100x100 mm Operation Mode Normal Mode, Practice Mode, Dry-Run Mode Control System Industrial Computer Operating System WINDOWS MTBA > 4 Hours UPH UPH ≥ 1000 Down Time < 3% (when running continuously for 3 months) Index Time < 0.4s (Minimum: 0.38s) Jam Rate ≤ 1/5000 Temperature Control Range Room Temperature to 125°C (DUT temperature can reach up to 150°C) Tray Standard JEDEC Standard Tray Loading/Unloading Mechanism 1x Automatic Loader / 4x Automatic Unloaders (Expandable) Empty Tray Handling Gripper Type Software Binning Bin1 - Bin16 Power Supply Specification 50/60 Hz, Max. 50A, AC 380V (Three-Phase) Machine Weight 3500 kg Machine Dimensions (L x W x H) 3189 x 3400 x 1920 mm
